Fine Lines in a Three Dimensional Interconnect

Three-Dimensional Molded Interconnect Devices (3D-MID)

Lines Through Segments in Three Dimensional Space

Given a set S of n line segments in three-dimensional space, finding all the lines that si-multaneously intersect at least of line segments in S is a fundamental problem that arises ina variety of domains including computer graphics, computer vision, robotics and automation,to mention a few. We refer to this problem as the lines-through-segments problem, or LTS forshort. We pres...

Three-Dimensional Interconnect Modeling for Nano-Scale VLSI Technologies

Designing high performance very large scale integration (VLSI) circuits has become more challenging than ever due to deep sub-micron effects and accelerating time-to-market cycles. With the increasing interconnect delay dominance and strong coupling effects, a small change in the design can cause new timing violations and result in design iterations. At the same time, the industry trend of inte...

Thermoelastic Interaction in a Three-Dimensional Layered Sandwich Structure

The present article investigates the thermoelastic interaction in a three-dimensional homogeneous and isotropic sandwich structure using the dual-phase-lag (DPL) model of generalized thermoelasticity. The incorporated resulting non-dimensional coupled equations are applied to a specific problem in which a sandwich layer of unidentical homogeneous and isotropic substances is subjected to time-de...

Heat Transfer in Three-Dimensional Flow along a Porous Plate

An analysis of heat transfer in the flow of a viscous, in-compressible fluid along an infinite porous plate is presented when the plate is subjected to a transverse sinusoidal suction. The flow field becomes three-dimensional due to this type of suction velocity. Expressions for the flow and temperature fields are obtained by series expansion method. It is found during the course of discussion ...